Thermal analysis assembly with distributed resista

专利名称：Thermal analysis assembly with distributed

resistance and integral flange for mountingvarious cooling devices

发明人：Danley, Robert L.,Schaefer, John W.申请号：EP02001504.6申请日：20020122公开号：EP1227317A3公开日：20040204

专利附图：

摘要：An improved differential thermal analysis/differential scanning calorimetry(collectively, DSC) assembly with a furnace block assembly having a measurement

chamber and a furnace heater. The measurement chamber has a sensor assembly forreceiving a sample material and a reference material. The furnace block assembly iscoupled to a generally cylindrical cooling flange through a distributed thermal resistorthat allows a constrained heat flow between the furnace assembly and cooling flange.The thermal resistor can also withstand the mechanical stresses associated with thedifferential expansion and contraction of the furnace assembly and cooling flangewithout permanent deformation of the thermal resistor. The cooling flange can becoupled to various cooling devices, permitting operation of the overall DSC instrument ina variety of temperature regimes for a variety of applications.

申请人：TA Instruments - Waters LLC

地址：109 Lukens Drive New Castle, Delaware 19720 US

国籍：US

代理机构：Tönhardt, Marion, Dr.

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