MCR100系列PDF资料

Preferred Device

Sensitive Gate

Silicon Controlled Rectifiers

Reverse Blocking Thyristors

PNPN devices designed for high volume, line-powered consumerapplications such as relay and lamp drivers, small motor controls, gatedrivers for larger thyristors, and sensing and detection circuits.Supplied in an inexpensive plastic TO-226AA package which isreadily adaptable for use in automatic insertion equipment.

Features

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SCRs0.8 A RMS100 thru 600 V•Sensitive Gate Allows Triggering by Microcontrollers and Other•••••••

Logic Circuits

Blocking Voltage to 600 V

On−State Current Rating of 0.8 Amperes RMS at 80°CHigh Surge Current Capability − 10 A

Minimum and Maximum Values of IGT, VGT and IH Specifiedfor Ease of Design

Immunity to dV/dt − 20 V/msec Minimum at 110°CGlass-Passivated Surface for Reliability and UniformityPb−Free Packages are Available*

GAKMARKINGDIAGRAM

MCR100−xAYWW

1

TO−92 (TO−226)CASE 029STYLE 10

23

xAYWW= Specific Device Code= Assembly Location= Year

= Work Week

PIN ASSIGNMENT

123

CathodeGateAnode

ORDERING INFORMATION

See detailed ordering and shipping information in the packagedimensions section on page 2 of this data sheet.

Preferred devices are recommended choices for future useand best overall value.

*For additional information on our Pb−Free strategy and soldering details, pleasedownload the ON Semiconductor Soldering and Mounting TechniquesReference Manual, SOLDERRM/D.

© Semiconductor Components Industries, LLC, 2005

1

January, 2005 − Rev. 6

Publication Order Number:

MCR100/D

MCR100 Series

ORDERING INFORMATION

DeviceMCR100−003MCR100−004MCR100−006MCR100−008MCR100−3RLMCR100−6RLMCR100−6RLRAMCR100−6RLRMMCR100−6ZL1MCR100−8RLMCR100−003GMCR100−006GMCR100−008GMCR100−3RLGMCR100−6RLGMCR100−6RLRAGMCR100−6RLRMGMCR100−6ZL1GMCR100−8RLG2000Units/Tape&AmmunitionBox2000 Units / Tape & Ammunition Box2000 Units / Tape & ReelTO−92 (TO−226)TO92(TO226)(Pb−Free)2000Units/Tubes2000 Units / Tubes2000 Units / Tape & Reel5000 Units / Bulk2000Units/Tape&AmmunitionBox2000 Units / Tape & Ammunition Box2000 Units / Tape & ReelTO92(TO226)TO−92 (TO−226)2000 Units / Tape & Reel5000Units/Bulk5000 Units / BulkPackage CodeShipping††For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

RatingPeak Repetitive Off−State Voltage (Note 1)(TJ = *40 to 110°C, Sine Wave, 50 to 60 Hz; Gate Open)MCR100−3MCR100−4MCR100−6MCR100−8On-State RMS Current, (TC = 80°C) 180° Conduction AnglesPeak Non-Repetitive Surge Current, (1/2 Cycle, Sine Wave, 60 Hz, TJ = 25°C)Circuit Fusing Consideration, (t = 8.3 ms)Forward Peak Gate Power, (TA = 25°C, Pulse Width v 1.0 ms)Forward Average Gate Power, (TA = 25°C, t = 8.3 ms)Forward Peak Gate Current, (TA = 25°C, Pulse Width v 1.0 ms)Reverse Peak Gate Voltage, (TA = 25°C, Pulse Width v 1.0 ms)Operating Junction Temperature Range @ Rate VRRM and VDRMStorage Temperature RangeIT(RMS)ITSMI2tPGMPG(AV)IGMVGRMTJTstgSymbolVDRM,VRRM1002004006000.8100.4150.10.101.05.0−40 to 110−40 to 150AAA2sWWAV°C°CValueUnitVMaximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limitvalues (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,damage may occur and reliability may be affected.

1.VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gatevoltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant currentsource such that the voltage ratings of the devices are exceeded.

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2

MCR100 Series

THERMAL CHARACTERISTICS

CharacteristicThermal Resistance,Junction−to−CaseJunction−to−AmbientLead Solder Temperature(t1/16″ from case, 10 secs max)SymbolRqJCRqJATLMax75200260Unit°C/W°CELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)

CharacteristicSymbolMinTypMaxUnitOFF CHARACTERISTICS

Peak Repetitive Forward or Reverse Blocking Current (Note 2)TC = 25°C(VD = Rated VDRM and VRRM; RGK = 1 kW)TC = 110°CIDRM, IRRM−−−−10100mAON CHARACTERISTICS

Peak Forward On−State Voltage*(ITM = 1.0 A Peak @ TA = 25°C)Gate Trigger Current (Continuous dc) (Note 3)(VAK = 7.0 Vdc, RL = 100 W)Holding Current(2)(VAK = 7.0 Vdc, Initiating Current = 20 mA)Latch Current(VAK = 7.0 V, Ig = 200 mA)Gate Trigger Voltage (Continuous dc) (Note 3)(VAK = 7.0 Vdc, RL = 100 W)TC = −40°CTC = 25°CTC = 25°CTC = −40°CTC = 25°CTC = −40°CTC = 25°CVTMIGTIHILVGT−−−−−−−−−400.5−0.6−0.62−1.72005.01010150.81.2VmAmAmAVDYNAMIC CHARACTERISTICS

Critical Rate of Rise of Off−State Voltage(VD = Rated VDRM, Exponential Waveform, RGK = 1000 W,TJ = 110°C)Critical Rate of Rise of On−State Current(IPK = 20 A; Pw = 10 msec; diG/dt = 1 A/msec, Igt = 20 mA)*Indicates Pulse Test: Pulse Width ≤ 1.0 ms, Duty Cycle ≤ 1%.2.RGK = 1000 W included in measurement.3.Does not include RGK in measurement.

dV/dtdi/dt20−35−−50V/msA/msVoltage Current Characteristic of SCR

+ Current

Anode +VTMon stateIRRM at VRRMIHSymbol

VDRMIDRMVRRMIRRMVTMIH

Parameter

Peak Repetitive Off State Forward VoltagePeak Forward Blocking Current

Peak Repetitive Off State Reverse VoltagePeak Reverse Blocking CurrentPeak on State VoltageHolding Current

Reverse Blocking Region(off state)Reverse Avalanche RegionAnode −+ VoltageIDRM at VDRMForward Blocking Region(off state)http://onsemi.com

3

MCR100 Series

100

GATE TRIGGER VOLTAGE (VOLTS)95

90GATE TRIGGER CURRENT ( m A)80706050403020

10

−40−25−1052035506580

TJ, JUNCTION TEMPERATURE (°C)

110

1.00.90.80.70.60.50.40.3

0.2

−40−25−1052035506580

TJ, JUNCTION TEMPERATURE (°C)

95

110

Figure 1. Typical Gate Trigger Current versus

Junction TemperatureFigure 2. Typical Gate Trigger Voltage versus

Junction Temperature

10001000

100

LATCHING CURRENT ( m A)95

110

HOLDING CURRENT ( m A)100

10

−40−25−1052035506580

TJ, JUNCTION TEMPERATURE (°C)10

−40−25−1052035506580

TJ, JUNCTION TEMPERATURE (°C)

95110

Figure 3. Typical Holding Current versus

Junction TemperatureFigure 4. Typical Latching Current versus

Junction Temperature

TC, MAXIMUM ALLOWABLE CASE TEMPERATURE (°C)12011010090807060504000.130°60°90°120°0.5180°DCIT, INSTANTANEOUS ON−STATE CURRENT (AMPS)10

MAXIMUM @ TJ = 25°CMAXIMUM @ TJ = 110°C1

0.20.30.4IT(RMS), RMS ON-STATE CURRENT (AMPS)

0.1

0.50.81.11.41.72.02.32.62.93.23.5VT, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS)

Figure 5. Typical RMS Current DeratingFigure 6. Typical On−State Characteristics

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4

MCR100 Series

TO−92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL

H2AH2AH2BH2BHW2H4H5L1LF1P2P1PH1W1WTT2P2DT1F2Figure 7. Device Positioning on Tape

SpecificationInchesSymbolDD2F1, F2HH1H2AH2BH4H5LL1PP1P2TT1T2WW1W2MillimeterMaxMin3.80.382.41.58.5001815.58.52.512.55.953.550.15—0.3517.55.5.15ItemTape Feedhole DiameterComponent Lead Thickness DimensionComponent Lead PitchBottom of Component to Seating PlaneFeedhole LocationDeflection Left or RightDeflection Front or RearFeedhole to Bottom of ComponentFeedhole to Seating PlaneDefective Unit Clipped DimensionLead Wire EnclosureFeedhole PitchFeedhole Center to Center LeadFirst Lead Spacing DimensionAdhesive Tape ThicknessOverall Taped Package ThicknessCarrier Strip ThicknessCarrier Strip WidthAdhesive Tape WidthAdhesive Tape PositionMin0.14960.0150.0945.0590.3346000.70860.6100.33460.098420.49210.23420.13970.06—0.0140.680.2165.0059Max4.20.512.84.09.51.01.019.516.511—12.96.753.950.201.440.65196.30.50.16530.0200.110.1560.37410.0390.0510.7680.90.433—0.50790.26580.15560.080.05670.0270.74810.28410.01968NOTES:

1. Maximum alignment deviation between leads not to be greater than 0.2 mm.

2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.3. Component lead to tape adhesion must meet the pull test requirements.

4. Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.

5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.6. No more than 1 consecutive missing component is permitted.

7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.8. Splices will not interfere with the sprocket feed holes.

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MCR100 Series

PACKAGE DIMENSIONS

TO−92 (TO−226)CASE 029−11ISSUE AL

ARPLSEATINGPLANEBNOTES:

1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.

2.CONTROLLING DIMENSION: INCH.

3.CONTOUR OF PACKAGE BEYOND DIMENSION RIS UNCONTROLLED.

4.LEAD DIMENSION IS UNCONTROLLED IN P ANDBEYOND DIMENSION K MINIMUM.

INCHESMINMAX0.1750.2050.1700.2100.1250.1650.0160.0210.0450.0550.0950.1050.0150.0200.500−−−0.250−−−0.0800.105−−−0.1000.115−−−0.135−−−MILLIMETERSMINMAX4.455.204.325.333.184.190.4070.5331.151.392.422.660.390.5012.70−−−6.35−−−2.042.66−−−2.2.93−−−3.43−−−KXXHV1DGJCNNSECTION X−XDIMABCDGHJKLNPRVSTYLE 10:

PIN 1.CATHODE

2.GATE3.ANODE

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Alloperating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rightsnor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. ShouldBuyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an EqualOpportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll FreeUSA/CanadaJapan: ON Semiconductor, Japan Customer Focus Center2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051Phone: 81−3−5773−3850http://onsemi.com6MCR100/D