专利名称：Optoelectronic Semiconductor Chip and
Method for Producing OptoelectronicSemiconductor Chips
发明人：KARL ENGL,MARKUS MAUTE,STEFANIE
RAMMELSBERGER,ANNA KASPRZAK-ZABLOCKA
申请号：US15098926申请日：20160414
公开号：US20160225943A1公开日：20160804
专利附图：
摘要：An optoelectronic semiconductor chip has a semiconductor body and a
substrate on which the semiconductor body is disposed. The semiconductor body has anactive region disposed between a first semiconductor layer of a first conductor type anda second semiconductor layer of a second conductor type. The first semiconductor layeris disposed on the side of the active region facing the substrate. The first semiconductorlayer is electrically conductively connected to a first termination layer that is disposedbetween the substrate and the semiconductor body. An encapsulation layer is disposedbetween the first termination layer and the substrate and, in plan view of the
semiconductor chip, projects at least in some regions over a side face which delimits thesemiconductor body.
申请人：OSRAM OPTO SEMICONDUCTORS GMBH
地址：REGENSBURG DE
国籍：DE
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