Radiation sensitive composition

专利名称：Radiation sensitive composition发明人：Munirathna Padmanaban,Natsumi

Suehiro,Yoshiaki Kinoshita,Satoru

Funato,Seiya Masuda,Hiroshi Okazaki,GeorgPawlowski

申请号：US08/864375申请日：19970528公开号：US05738972A公开日：19980414

摘要：A chemically amplified resist material comprising: a) a homopolymer or acopolymer of hydroxystyrene or hydroxystyrene partly protected by a group sensitive toan acid such as a tetrahydropyranyl or t- butoxycarbonyl group, b) a dissolution inhibitorsuch as poly(N,O- acetal) or phenol or bisphenol protected by a group cleavable with anacid, c) a photosensitive compound capable of generating an acid upon exposure, d) abase capable of degrading upon radiation to regulate the line width in a period betweenthe exposure step and the processing steps after exposure, e) a low-molecular weightphenolic or polyphenolic compound having a structure represented by the followinggeneral formula or a mixture of the phenolic or polyphenolic compounds: ##STR1##where n is an integer of 1 to 5, m is an integer of 0 to 4, n+m≦5, and p is an integer of 1 to10, each R is a C.sub.1 -C.sub.12 alkyl group or an unsubstituted or substituted cycloalkylgroup or a C.sub.1 -C.sub.5 hydroxyalkyl group, provided that hydrogen atoms may besubstituted with a halogen atom and, when m is not less than 2, each R may be the sameor different; A represents a hydrocarbon atomic grouping, having a valence of p, including

an unsubstituted or substituted C.sub.1 -C.sub.100 alicyclic, chain aliphatic, or aromatichydrocarbon or a combination thereof with the carbon atoms being optionally

substituted with an oxygen atom, provided that when p is 1, A may represent a hydrogenatom and, when p is 2, A may represent --S--, --SO--, --SO.sub.2 --, --O--, --CO--, or a directbond, and f) a solvent for dissolving the components a) to e).

申请人：HOECHST JAPAN LIMITED

代理机构：Foley & Lardner

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