METHOD FOR MANUFACTURING CHIP-MOUNTING SUBSTRATE,

专利名称：METHOD FOR MANUFACTURING CHIP-MOUNTING SUBSTRATE, AND CHIP-MOUNTING SUBSTRATE

发明人：AHN, Bum Mo,PARK, Seung Ho,SONG, Tae

Hwan

申请号：EP17169523.2申请日：20170504公开号：EP3246958A1公开日：20171122

专利附图：

摘要：A method for manufacturing a chip-mounting substrate includes a precoating

step of forming a precoat on a substrate including a plurality of conductive portions andan insulating portion interposed between the conductive portions, an etching step ofetching at least a portion of the precoat through a laser to form a pattern, and a step offorming a metal layer on the substrate. The pattern is disposed on at least one of theconductive portions, and the metal layer is formed in the pattern.

申请人：Point Engineering Co., Ltd.

地址：89 Asan Valley-ro Dunpo-myeon Asan-si, Chungcheongnam-do 31409 KR

国籍：KR

代理机构：Peter, Julian

更多信息请下载全文后查看