专利名称：METHOD FOR ASSEMBLING
SEMICONDUCTOR CHIPS, AND
CORRESPONDING SEMICONDUCTOR CHIPASSEMBLY
发明人：BENZEL, HUBERT申请号：EP05787150.1申请日：20050824公开号：EP1805101B1公开日：20101027
摘要：The invention relates to a method for assembling semiconductor chips,comprising the following steps: a semiconductor chip (5``) is provided that has a surfaceencompassing a membrane area (55`) and a peripheral area. The peripheral area isprovided with an assembly area (MB) while a cavity (58') that extends all the way to theassembly area (MB) and joins an opening (58'a) there is located below the membranearea (55`); a substrate (1`; 10) is provided which has a surface with a recess (11); theassembly area (MB) of the semiconductor chip (5``) is assembled on the surface of thesubstrate (1`; 10) by means of a flip-chip technique in such a way that an edge (K) of therecess (11) lies between the assembly area (MB) and the membrane area (55`) while theopening (58`a) is oriented towards the substrate (1`; 10); the assembly area (MB) is filledunderneath with a filling (28), the edge (K) of the recess (11) being used as a break-offarea for the filling (28) such that no filling (28) penetrates into the membrane area (55);and a continuous hole (101`; 101``) is provided through the substrate (1`; 10) to theopening (58`a) of the cavity (58`). The invention also relates to a corresponding
semiconductor chip assembly.
申请人：ROBERT BOSCH GMBH,BOSCH GMBH ROBERT,ROBERT BOSCH GMBH
地址：DE
国籍：DE
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