专利名称：A method for preparing a printed wiring
board for installation in an IC card
发明人：NAKANISHI, Chiaki,HIROI,
Atsushi,YANAGAWA, Yoji
申请号：EP86904376.0申请日：19860714公开号：EP0231384B1公开日：19931006
摘要：The wiring board (10) has a conductor circuit (13) on the surface and contains anIC module (12) mounted with an IC chip (11). Both surfaces of the board are covered withover sheets (32). Bumpers (20) are formed on portions of the conductor circuit (13), whichserve as external contact terminals. The bumpers are made of any conductive material,such as copper or nickel, and the surfaces are to be coated with hard conductive alloys.The thickness should be 0.1-0.3mm so that the contact surface can be of the same levelas the over sheets. External contact terminals are thus resistant to outer mechanicalforces.
申请人：IBIDEN CO, LTD.
地址：1, KANDA-CHO 2-CHOME; OGAKI-SHI GIFU 503
代理机构：Sajda, Wolf E., Dipl.-Phys.
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