Micromechanical and microoptomechanical structures

专利名称：Micromechanical and microoptomechanical

structures with backside metalization

发明人：Bruce R. Scharf,Andrew J. Zosel,Joel A.

Kubby,Peter M. Gulvin,Chuang-ChiaLin,Jingkuang Chen,Alex T. Tran

申请号：US10192087申请日：20020709

公开号：US20020192852A1公开日：20021219

专利附图：

摘要：The present invention provides a micromechanical or microoptomechanical

structure produced by a process comprising defining the structure in a single-crystalsilicon layer separated by an insulator layer from a substrate layer; selectively etchingthe single crystal silicon layer; depositing and etching a polysilicon layer on the insulatorlayer, with remaining polysilicon forming mechanical elements of the structure;metalizing a backside of the structure; and releasing the formed structure.

申请人：SCHARF BRUCE R.,ZOSEL ANDREW J.,KUBBY JOEL A.,GULVIN PETER M.,LINCHUANG-CHIA,CHEN JINGKUANG,TRAN ALEX T.

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