PD -94000
IRF7328
HEXFET® Power MOSFET
Trench Technology
q Ultra Low On-Resistanceq Dual P-Channel MOSFETq Available in Tape & Reel
q
VDSS-30V
RDS(on) max
21mΩ@VGS = -10V32mΩ@VGS = -4.5V
ID-8.0A-6.8A
Description
New trench HEXFET® Power MOSFETs fromInternational Rectifier utilize advanced processingtechniques to achieve extremely low on-resistanceper silicon area. This benefit, combined with theruggedized device design that HEXFET powerMOSFETs are well known for, provides the designerwith an extremely efficient and reliable device for usein battery and load management applications.
S1G1S2G21287D1D1D2D23645Top ViewSO-8Absolute Maximum Ratings
Parameter
Max.
Units
VDSDrain-Source Voltage-30VID @ TA = 25°CContinuous Drain Current, VGS @ -10V-8.0ID @ TA = 70°CContinuous Drain Current, VGS @ -10V-6.4AIDMPulsed Drain Current-32PD @TA = 25°CMaximum Power Dissipation2.0WPD @TA = 70°CMaximum Power Dissipation1.3W Linear Derating Factor 16 mW/°C VGS Gate-to-Source Voltage ± 20 VTJ , TSTGJunction and Storage Temperature Range-55 to + 150°C
Thermal Resistance
Parameter
RθJA
Maximum Junction-to-Ambient Max. Units 62.5 °C/Wwww.irf.com1
10/04/00
元器件交易网www.cecb2b.com
IRF7328
元器件交易网www.cecb2b.com
IRF7328
元器件交易网www.cecb2b.com
IRF7328
元器件交易网www.cecb2b.com
IRF7328
元器件交易网www.cecb2b.com
IRF7328
元器件交易网www.cecb2b.com
IRF7328
元器件交易网www.cecb2b.com
IRF7328
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