专利名称：Method of Integrating Epitaxial Film Onto
Assembly Substrate
发明人：Eric Ting-Shan Pan申请号：US13487561申请日：20120604
公开号：US20120238078A1公开日：20120920
专利附图：
摘要：A method of growing an epitaxial film and transferring it to an assemblysubstrate is disclosed. The film growth and transfer are made using an epitaxy lateralovergrowth technique. The formed epitaxial film on an assembly substrate can be further
processed to form devices such as solar cell, light emitting diode, and other devices andassembled into higher integration of desired applications.
申请人：Eric Ting-Shan Pan
地址：Fremont CA US
国籍：US
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