元器件交易网www.cecb2b.com BTS428L2 Functional diagram overvoltage protectioninternal voltage supply ESD logic gate control + charge pump current limitVBB clamp for inductive loadOUT IN temperature sensor Open load detection LOAD ST GND PROFET
Pin Definitions and Functions Pin 1 Symbol GND Function Logic ground Pin configuration (top view) Tab = VBBInput, activates the power switch in 2 IN case of logical high signal 3 Vbb Positive power supply voltage The tab is shorted to pin 3 1 2 (3) 4 5GND IN ST OUT4 ST Diagnostic feedback, low on failure 5 OUT Tab Vbb Output to the load Positive power supply voltage The tab is shorted to pin 3 Infineon Technologies AG Page 2 2003-Oct-01
元器件交易网www.cecb2b.com BTS428L2 Maximum Ratings at Tj = 25 °C unless otherwise specified Parameter Symbol Values UnitSupply voltage (overvoltage protection see page 4) Vbb 43VSupply voltage for full short circuit protection Vbb 24VTj Start=-40 ...+150°C 3)1)Load dump protection V60VLoadDump = VA + Vs, VA = 13.5 V VLoad dump 2) RI= 2 Ω, RL= 4.0 Ω, td= 200 ms, IN= low or high Load current (Current limit, see page 5) IL self-limitedAOperating temperature range Tj -40 ...+150°C-55 ...+150Storage temperature range Tstg Power dissipation (DC), TC ≤ 25 °C Ptot 75WMaximal switchable inductance, single pulse Vbb = 12V, Tj,start = 150°C, TC = 150°C const. 4) (See diagram on page 9) IL(ISO) = 7 A, RL = 0 Ω; EAS=0.19J: ZL 5.6mHElectrostatic discharge capability (ESD) IN: VESD 1.0kV (Human Body Model) ST: 4.0 out to all other pins shorted: 8.0 acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993; R=1.5kΩ; C=100pF Input voltage (DC) VIN -10 ... +16VCurrent through input pin (DC) IIN ±2.0mA±5.0Current through status pin (DC) IST see internal circuit diagrams page 8 Thermal Characteristics Parameter and Conditions Symbol Values Unit min typ max Thermal resistance chip - case: RthJC -- -- 1.67K/W-- -- 75 junction - ambient (free air): RthJA -- 42 -- device on pcb5): 1) Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins (a 150Ω resistor for the GND connection is recommended). 2) RI = internal resistance of the load dump test pulse generator 3) VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 4) EAS is the maximum inductive switch-off energy 5) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for Vbb connection. PCB is vertical without blown air. Infineon Technologies AG Page 3 2003-Oct-01
元器件交易网www.cecb2b.com BTS428L2 Electrical Characteristics Parameter and Conditions Symbol Values Unitat Tj =-40...+150°C, Vbb = 12 V unless otherwise specified min typ max Load Switching Capabilities and Characteristics On-state resistance (pin 3 to 5) IL = 2 A; VBB ≥ 7V see diagram, page 10 Tj=25 °C: RON Tj=150 °C: IL(ISO) IL(GNDhigh) -- 50 100 60120mΩNominal load current, (pin 3 to 5) ISO 10483-1, 6.7:VON=0.5V, TC=85°C Output current (pin 5) while GND disconnected or GND pulled up6) , Vbb=30 V, VIN= 0, see diagram page 8 5.8 7.0 --AmAµs-- -- 230 30 100 100 200200Turn-on time IN Turn-off time IN RL = 12 Ω, Slew rate on 10 to 30% VOUT, RL = 12 Ω, Slew rate off 70 to 40% VOUT, RL = 12 Ω, to 90% VOUT: ton to 10% VOUT: toff dV /dton 0.1 -- 1-dV/dtoff 0.1 -- 1 V/µsV/µs Operating Parameters Operating voltage Overvoltage protection7) Ibb=40 mA 8)Standby current (pin 3) VIN=0; see diagram on page 10 Tj =-40Vbb(on) 4.75 -- 41Tj =+25...+150°C: -- 43Tj =-40°C:Vbb(AZ) 41 -- --Tj =25...+150°C: 43 47 52Tj=-40...+25°C:Ibb(off) -- 5 9Tj= 150°C: -- -- 25IL(off) -- 1 10Off-State output current (included in Ibb(off)) VIN=0 Operating current 9), VIN=5 V IGND -- 0.8 1.5 VVµAµAmA 6) not subject to production test, specified by design 7) Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins (a 150Ω resistor for the GND connection is recommended. See also VON(CL) in table of protection functions and circuit diagram page 8. 8) Measured with load 9) Add IST, if IST > 0, add IIN, if VIN>5.5 V Infineon Technologies AG Page 4 2003-Oct-01
元器件交易网www.cecb2b.com BTS428L2 Parameter and Conditions Symbol Values Unitat Tj =-40...+150°C, Vbb = 12 V unless otherwise specified min typ max Protection Functions10) Current limit (pin 3 to 5) IL(lim) (see timing diagrams on page 12) Tj =-40°C: 21 28 36A Tj =25°C:17 22 31 Tj =+150°C: 12 16 24Repetitive short circuit shutdown current limit IL(SCr) Tj = Tjt (see timing diagrams, page 12) -- 17 --AThermal shutdown time11 Tj,start = 25°C: toff(SC) -- 7.5 --ms (see timing diagrams on page 12) Output clamp (inductive load switch off) 41 at VOUT = Vbb - VON(CL) IL= 40 mA: VON(CL) 43 47 52VThermal overload trip temperature Tjt 150 -- --°CThermal hysteresis ∆Tjt -- 10 --KReverse battery (pin 3 to 1) 12) -Vbb -- -- 32VReverse battery voltage drop (Vout > Vbb)13) IL = -2 A Tj=150 °C: -VON(rev) -- 600 --mV Diagnostic Characteristics Open load detection current (on-condition) IL (OL) 10 -- 500mA 10) Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as \"outside\" normal operating range. Protection functions are not designed for continuous repetitive operation. 11) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for Vbb connection. PCB is vertical without blown air. 12) Requires 150 Ω resistor in GND connection. The reverse load current through the intrinsic drain-source diode has to be limited by the connected load. Note that the power dissipation is higher compared to normal operating conditions due to the voltage drop across the intrinsic drain-source diode. The temperature protection is not active during reverse current operation! Input and Status currents have to be limited (see max. ratings page 3 and circuit page 8). 13) not subject to production test, specified by design Infineon Technologies AG Page 5 2003-Oct-01
元器件交易网www.cecb2b.com BTS428L2 Parameter and Conditions Symbol Values Unitat Tj =-40...+150°C, Vbb = 12 V unless otherwise specified min typ max Input and Status Feedback Input resistance see circuit page 8 Input turn-on threshold voltage Input turn-off threshold voltage Input threshold hysteresis Off state input current (pin 2), VIN = 0.4 V On state input current (pin 2), VIN = 5 V Delay time for status with open load after switch off (see timing diagrams on page 12) 14) RI 2.5 3.5 6 kΩVIN(T+) 1.7 -- 3.2VVIN(T-) 1.5 -- --V∆ VIN(T) -- 0.5 --V IIN(off) 1 -- 50µAIIN(on) 20 50 90µAtd(ST OL4) 100 520 900µs 5.4 -- 6.1 -- Status output (open drain) Zener limit voltage ST low voltage IST = +1.6 mA: VST(high) IST = +1.6 mA: VST(low) --0.4V 14) If a ground resistor RGND is used, add the voltage drop across this resistor. Infineon Technologies AG Page 6 2003-Oct-01
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BTS428L2 Truth Table Input Output Status level level BTS 428L2 Normal operation Open load Overtem-perature L H L H L H L H Z H L L H H H L H L L = \"Low\" Level H = \"High\" Level X = don't care Z = high impedance, potential depends on external circuit Status signal after the time delay shown in the diagrams (see fig 5. page 12) Infineon Technologies AG Page 7 2003-Oct-01
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BTS428L2 Terms IbbIIN2ISTVVbbRINVST4STGND1GNDIGNDVOUTIN3VbbILPROFETOUT5VONOvervolt. and reverse batt. protection + 5V+ VbbVINRSTRILogicRSTSTVZ1Z2OUTPROFETGND RGNDSignal GNDRLoadLoad GND Input circuit (ESD protection) RINIVZ1 = 6.1 V typ., VZ2 = 47 V typ., RGND = 150 Ω, RST= 15 kΩ, RI= 3.5 kΩ typ. In case of reverse battery the load current has to be limited by the load. Temperature protection is not active ESD-ZDIGNDIIOpen-load detection in on-state Open load, if VON < RON·IL(OL); IN high + VbbThe use of ESD zener diodes as voltage clamp at DC conditions is not recommended Status output +5VONVONOUTRST(ON)STLogicunitOpen loaddetectionGNDESD-ZD GND disconnect ESD-Zener diode: 6.1 V typ., max 5.0 mA; RST(ON) < 375 Ω at 1.6 mA. The use of ESD zener diodes as voltage clamp at DC conditions is not recommended. 3INVbbPROFET4STGND1VGNDOUTInductive and overvoltage output clamp 2+ VbbVZ5VONVbbVINVSTOUTGND Any kind of load. In case of Input=high is VOUT ≈ VIN - VIN(T+) . Due to VGND >0, no VST = low signal available. PROFET VON clamped to 47 V typ. Infineon Technologies AG Page 8 2003-Oct-01
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BTS428L2 GND disconnect with GND pull up Inductive Load switch-off energy dissipation EbbEASOUT53INVbbPROFET4STGND1VVbbINSTVV2INVbbPROFETOUTELoad=GNDSTGNDELZL Any kind of load. If VGND > VIN - VIN(T+) device stays off Due to VGND >0, no VST = low signal available. {LRLER Energy stored in load inductance: EL = 1/2·L·IL While demagnetizing load inductance, the energy dissipated in PROFET is 2Vbb disconnect with energized inductive load 3high2INVbbPROFET4STGND1OUT EAS= Ebb + EL - ER= VON(CL)·iL(t) dt, 5with an approximate solution for RL > 0 Ω: IL·LIL·RL ) EAS= 2·R·(Vbb + |VOUT(CL)|)· ln (1+ |VLOUT(CL)| Vbb For inductive load currents up to the limits defined by ZL (max. ratings and diagram on page 9) each switch is protected against loss of Vbb. Consider at your PCB layout that in the case of Vbb dis-connection with energized inductive load all the load current flows through the GND connection. Maximum allowable load inductance for a single switch off L = f (IL ); Tj,start = 150°C,TC = 150°C const., Vbb = 12 V, RL = 0 Ω ZL [mH] 1000 1001010.1271217 IL [A] Infineon Technologies AG Page 9 2003-Oct-01
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BTS428L2 Typ. on-state resistance RON = f (Vbb,Tj ); IL = 2 A, IN = high RON [mΩ] 17515012510075502503 5 7 9 Tj=150°C25°C-40°C3040Vbb [V] Typ. standby current Ibb(off) = f (Tj ); Vbb = 9...34 V, IN1,2 = low Ibb(off) [µA] 454035302520151050-50 050100150200 Tj [°C] Infineon Technologies AG Page 10 2003-Oct-01
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BTS428L2 Timing diagrams Figure 1a: Vbb turn on: IN Figure 2b: Switching a lamp, INVbbSTVOUTVOUTST open draintILproper turn on under all conditions tThe initial peak current should be limited by the lamp and not by the current limit of the device. Figure 2a: Switching a resistive load, turn-on/off time and slew rate definition: Figure 2c: Switching an inductive load ININVOUT90%tondV/dton10%tdV/dtoffSTVoffOUTILILIL(OL)tt *) if the time constant of load is too large, open-load-status may occur Infineon Technologies AG Page 11 2003-Oct-01
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BTS428L2 Figure 3a: Short circuit shut down by overtemperature, reset by cooling INother channel: normal operation Figure 5a: Open load: detection in ON-state, open load occurs in on-state INISTLtd(ST OL)td(ST OL)IL(lim)IL(SCr)VOUTtSToff(SC)ItnormalLopennormalt td(ST OL) = 10 µs typ. Heating up of the chip may require several milliseconds, depending on external conditions Figure 4a: Overtemperature: Reset if Tj BTS428L2 Package and Ordering Code All dimensions in mm Dpak-5 Pin: P-TO252-5-11 Sales code BTS428L2 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81669 München © Infineon Technologies AG 2001 All Rights Reserved. Ordering code 6.5+0.15-0.055.7 MAX.(4.24)1±0.11)Q67060-S7403-A2 Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. AB0.8±0.152.3+0.05-0.100.5+0.08-0.04Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information (5)9.98±0.56.22-0.20.9+0.20-0.010...0.150.51 MIN.0.15 MAX.per side5 x 0.6±0.11.140.5+0.08-0.044.560.1B0.25MABFor further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings 1) Includes mold flashes on each side.All metal surfaces tin plated, except area of cut. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Infineon Technologies AG Page 13 2003-Oct-01 因篇幅问题不能全部显示，请点此查看更多更全内容