Integrated circuit lead structure

专利名称：Integrated circuit lead structure发明人：DE GRAAFF; PHILIP JOHAN申请号：US43338774申请日：19740114公开号：US3868725A公开日：19750225

摘要：The semiconductor device comprises an insulating foil on which a pattern ofconductor tracks is present and a semiconductor body with contact places which areconnected to facing ends of the conductor tracks. External conductors are connected tothe other ends of the conductor tracks and consist of flat strips which project from anenvelope on oppositely located envelope sides, the conductors being provided with aholding element on their end facing the foil, the distance of holding elements ofoppositely located conductors being smaller than the foil width at that area. A coolingplate against which the semiconductor body bears with its side remote from the contactplaces is present near a wall of the envelope.

申请人：U.S. PHILIPS CORPORATION

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